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Welcome to the 2010 ITC Web

Updates and News

The Paper Submission Deadline is Fast Approaching

ITC Papers are due by March 17, 2010. See below for more details or go to the Papers page.

ITC Partner-Conference Track

If you are an organizer of a related conference, we are offering the opportunity to highlight some of your best papers in a special ITC track, See the Papers page for more information.

Start planning to attend ITC 2010

2010 TestWeek will be in Austin once, more, from October 31 – November 5 2010. ITC itself will be held November 2 – 4. The 2010 ITC Call for Papers is now available. See you in Austin in 2010!

There are many ways to get involved with ITC.

  • Write and submit a regular or lecture series paper to ITC. The Call for Papers is now available. If you are not already registered, register now at the ITC Program Site

  • Exhibit at ITC. ITC, with an attendee base of test experts and decision makers, is the best place to get in touch with existing and potential customers. See the Exhibiting at ITC page for more information.

  • Volunteer at ITC. Sign up as an ITC paper reviewer at the ITC Program Site, and contact a member of the Program Committee responsible for your area of expertise to request papers to review, after the paper deadline date.


    If you are an avid social networker, we are looking for help in placing ITC on Twitter, Facebook, and the like. ITC is also looking for volunteers to help with marketing the conference in Austin and for many other jobs.
    Use the Contact Us link below for more information.

  • Attend ITC. The Advance Program will be available in July, which is when registration will be opened.

The ITC Photo Gallery

International Test Conference

International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.

Congratulations to 2008 Best Paper Award Winners and Honorable Mentions

ITC Ned Kornfield Best Paper Award for 2008

Test Access Mechanism for Multiple Identical Cores, by G. Giles, J. Wang, A. Seghal, L.J. Balakrishnan, and J. Wingfield, Advanced Micro Devices

Honorable Mentions

A Method to Generate a Very-Low-Distortion, High-Frequency Sine Waveform Using an AWG, A. Maeda, Verigy Japan

Efficiently Performing Yield Enhancements by Identifying Dominant Physical Root Cause from Test Fail Data, M. Sharma, R. Benware, L. Ling, D. Abercrombie, L. Lee, M. Keim, H. Tang, W-T. Cheng, T-P. Tai, Mentor Graphics,; Y-J. Chang, R. Lin, UMC; A. Man, Advanced Micro Devices

Important Links

Complete List of 2010 Exhibitors.

ITC Exhibitors with additional information. Click the logo for the exhibitor page.

Media Partners

Author Log-in to ITC Program Site

More information:

ITC office
phone: +1 (202) 973-8665
fax: +1 (202) 331-0111
email: ITC@courtesyassoc.com